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Brands > OCZ Products > OCZ Memory Modules - ReaperX HPC (Heat Pipe Conduit) Series
Click to View Website - OCZ Memory Modules - ReaperX HPC (Heat Pipe Conduit) Series

ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme efficiency due to a new dual copper heat pipe design. Each memory chip is in direct contact with a thermo-conductive pipe that guides the performance robbing heat away from key memory components and quickly dissipates it through the aluminum fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.


These high-performance modules will support the latest games and top of the line multimedia programs with a 4GB capacity, combined with the high frequencies and aggressive bandwidth for maximum system stability. Rated at DDR2-800 with 4-4-3 timings, the PC2-6400 ReaperX provides exceptional latencies for the extreme enthusiast and gamer. The sheer speeds combined with the 4GB capacity of this kit will provide you with unsurpassed reliability, system responsiveness, and stable performance.

The ReaperX series provides enthusiasts leading-edge cooling technology, with each memory chip in direct contact with a thermo-conductive pipe that guides heat away and quickly dissipates it through the aluminum fin array.

Featuring an EPP (Enhanced Performance Profiles) programmed SPD, PC2-6400 Reaper X modules will immediately boot at the rated specs on the latest generation of NVIDIA® SLI™ chipsets. Although the OCZ Reaper X series caters to enthusiasts, EPP eliminates the need for manual configuration and makes the benefits of overclocking available to the complete range of consumers looking to get the most out of their systems.

As one of OCZ's legendary Enhanced Bandwidth (EB) editions, the ReaperX 4GB kit increases effective memory bandwidth through the optimization of memory latencies between the system memory, the chipset, and memory controller, resulting in the ideal balance of speed and enhanced timings.
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