 | Entering the memory market in August 2000, OCZ Technology was built around the determination to manufacture the best high speed DDR and RDRAM. OCZ was founded by enthusiasts, for enthusiasts, and our commitment to the end-user has not digressed. OCZ Technology has been an innovator in many areas. We were the first manufacturer to make Dual Channel optimized memory available to the public, which originally took advantage of nVidia's Twinbank or Dual DDR architecture, found in their nForce chipset. We have now taken that technology and tailored it for the Canterwood, and Granite Bay chipset's. OCZ developed and was the first to implement ULN technology, which has been a critical element in our manufacturing process for some time.
OCZ naming conventions: XTC (Xtreme Thermal Convection): OCZ's proprietary heatspreader technology (honeycomb design) Reaper: A pure copper heat pipe design cooler Platinum: Features Enhanced Latency and Enhanced Bandwidth technology Value Select: Value for money EPP: Enhanced Performance Profiles (NVIDIA® technology) XMP: Extreme Memory Profiles (Intel® technology)
OCZ ULN Technology: http://www.ocztechnology.com/displaypage.php?name=what_is_noise_and_interference
Find out which OCZ memory module is right for you: http://www.ocztechnology.com/support/motherboard
OCZ Part Numbers: http://www.ocztechnology.com/displaypage.php?name=part_num_guide_intro
Intel® XMP (Extreme Memory Profiles): http://www.intel.com/Consumer/Game/extreme-memory.htm
NVIDIA® EPP (Enhanced Performance Profiles): http://www.legitreviews.com/article/345/1/
NVIDIA® SLi™ Certified Power Supplies: http://www.slizone.com/object/slizone_build_psu.html
ATi™ CrossFire™ Certified Power Supplies: http://game.amd.com/us-en/crossfirex_components.aspx?p=3 |